Misc exhibit modular approval letter
FCC ID XJQMSLINK0001
Serial Link Wireless DSSS Module
MicroStrain, Inc.
Document ID #1171685
This document is available from the following links. Linking directly to FCC.gov may result in an error.
- https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=1171685
- https://fccid.io/XJQMSLINK0001/Attestation-Statements/Misc-exhibit-modular-approval-letter-1171685
- https://fccid.io/XJQMSLINK0001/Attestation-Statements/Misc-exhibit-modular-approval-letter-1171685.pdf
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