Modular Approval Letter
FCC ID XJQMSLINK0002
2.4 GHz OEM Wireless Module
MicroStrain, Inc.
Document ID #1313594
This document is available from the following links. Linking directly to FCC.gov may result in an error.
- https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=1313594
- https://fccid.io/XJQMSLINK0002/Letter/Modular-Approval-Letter-1313594
- https://fccid.io/XJQMSLINK0002/Letter/Modular-Approval-Letter-1313594.pdf
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