Cover Letter

FCC ID FPWST0713

MID WITH BT/WI-FI

Jing Mold Electronic Technology (Shen Zhen) Co., Ltd.

1. FCC ID
2. Jing Mold Electronic Technology (Shen Zhen) Co., Ltd.
3. FPWST0713
4. Cover Letter

Document ID #1513199

This document is available from the following links. Linking directly to FCC.gov may result in an error.

• https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=1513199
• https://fccid.io/FPWST0713/Letter/Cover-Letter-1513199
• https://fccid.io/FPWST0713/Letter/Cover-Letter-1513199.pdf

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