Authorization letter (William)

FCC ID A3LMU733-W

HSPA+ Module

Samsung Electronics Co Ltd

1. FCC ID
2. Samsung Electronics Co Ltd
3. A3LMU733-W
4. Authorization letter (William)

Document ID #1856496

This document is available from the following links. Linking directly to FCC.gov may result in an error.

• https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=1856496
• https://fccid.io/A3LMU733-W/Letter/Authorization-letter-William-1856496
• https://fccid.io/A3LMU733-W/Letter/Authorization-letter-William-1856496.pdf

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