SAMSUNG_FCC authorization letter
FCC ID A3LMU733-J
HSPA+ Module
Samsung Electronics Co Ltd
Document ID #1857179
This document is available from the following links. Linking directly to FCC.gov may result in an error.
- https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=1857179
- https://fccid.io/A3LMU733-J/Letter/SAMSUNG-FCC-authorization-letter-1857179
- https://fccid.io/A3LMU733-J/Letter/SAMSUNG-FCC-authorization-letter-1857179.pdf
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