Cover Letter for Request Modular Approval

FCC ID 2AD56HLK-M35

WIFI module

Shenzhen Hi-Link Electronic co., Ltd.

1. FCC ID
2. Shenzhen Hi-Link Electronic co., Ltd.
3. 2AD56HLK-M35
4. Cover Letter for Request Modular Approval

Document ID #2532373

This document is available from the following links. Linking directly to FCC.gov may result in an error.

• https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=2532373
• https://fccid.io/2AD56HLK-M35/Letter/Cover-Letter-for-Request-Modular-Approval-2532373
• https://fccid.io/2AD56HLK-M35/Letter/Cover-Letter-for-Request-Modular-Approval-2532373.pdf

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