Modular Appr Letter

FCC ID ZQ6-WSDT752BSC

BLE SiP

AMPAK Technology Inc.

1. FCC ID
2. AMPAK Technology Inc.
3. ZQ6-WSDT752BSC
4. Modular Appr Letter

Document ID #3949467

This document is available from the following links. Linking directly to FCC.gov may result in an error.

• https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=3949467
• https://fccid.io/ZQ6-WSDT752BSC/Letter/Modular-Appr-Letter-3949467
• https://fccid.io/ZQ6-WSDT752BSC/Letter/Modular-Appr-Letter-3949467.pdf

Sending you directly to the document available from FCC.gov...