test photo 3
FCC ID QOQWRAP2022-1-B2B
Bluetooth Board-to-Board Module
Silicon Laboratories Finland Oy
Document ID #471864
This document is available from the following links. Linking directly to FCC.gov may result in an error.
- https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=471864
- https://fccid.io/QOQWRAP2022-1-B2B/Test-Setup-Photos/test-photo-3-471864
- https://fccid.io/QOQWRAP2022-1-B2B/Test-Setup-Photos/test-photo-3-471864.pdf
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