Modular Approval Letter
FCC ID 2AD56HLK-RM58S
WIFI module
Shenzhen Hi-Link Electronic co., Ltd.
Document ID #4747718
This document is available from the following links. Linking directly to FCC.gov may result in an error.
- https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=4747718
- https://fccid.io/2AD56HLK-RM58S/Letter/Modular-Approval-Letter-4747718
- https://fccid.io/2AD56HLK-RM58S/Letter/Modular-Approval-Letter-4747718.pdf
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