Modular Approval Letter
FCC ID 2AD56HLK-B32
Wi-Fi Module
Shenzhen Hi-Link Electronic co., Ltd.
Document ID #6207308
This document is available from the following links. Linking directly to FCC.gov may result in an error.
- https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=6207308
- https://fccid.io/2AD56HLK-B32/Letter/Modular-Approval-Letter-6207308
- https://fccid.io/2AD56HLK-B32/Letter/Modular-Approval-Letter-6207308.pdf
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