Cover Letter_C2PC Letter

FCC ID 2ADHKWBZ451

Wireless Module

Microchip Technology Inc.

1. FCC ID
2. Microchip Technology Inc.
3. 2ADHKWBZ451
4. Cover Letter_C2PC Letter

Document ID #7793997

This document is available from the following links. Linking directly to FCC.gov may result in an error.

• https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7793997
• https://fccid.io/2ADHKWBZ451/Letter/Cover-Letter-C2PC-Letter-7793997
• https://fccid.io/2ADHKWBZ451/Letter/Cover-Letter-C2PC-Letter-7793997.pdf

Sending you directly to the document available from FCC.gov...