FCC ID 2APD9-RSL10SIP
Bluetooth 5 System-in-Package Module
by ON Semiconductor
Grantee Code: 2APD9 Product Code: RSL10SIP
Latest application date: 2018-09-17
FCC ID Device Details
| FCC ID | 2APD9-RSL10SIP |
|---|---|
| Mirrors | fcc.id | gov | fccid.ai |
| Grantee Code | 2APD9 |
| Product Code | RSL10SIP |
| Applicant Business | ON Semiconductor 🇨🇦 |
| Related Domains |  onsemi.com |
| Equipment Class | Bluetooth 5 System-in-Package Module |
| Test Firm | Nemko Canada Inc. (Ottawa) |
Operating Frequencies
| Frequency Range | Application Purpose | Final Action Date |
|---|---|---|
| 2402-2480 MHz | Original Equipment | 2018-09-17 |
Exhibits
| Document | Type | Available | File |
|---|---|---|---|
| user manual | Users Manual | 2019-03-16 | PDF 791.7 KB |
| external photos | External Photos | 2019-03-16 | PDF 104.1 KB |
| label details | ID Label/Location Info | 2018-09-17 | PDF 122.6 KB |
| test setup photos | Test Setup Photos | 2019-03-16 | PDF 2.6 MB |
| test report | Test Report | 2018-09-17 | PDF 1.8 MB |
| Cover letter | Cover Letter(s) | 2018-09-17 | PDF 54.8 KB |
| LT confidential letter | Cover Letter(s) | 2018-09-17 | PDF 121.5 KB |
| MA letter | Cover Letter(s) | 2018-09-17 | PDF 126.8 KB |
| ST confidential letter | Cover Letter(s) | 2018-09-17 | PDF 121.6 KB |
| agent letter | Cover Letter(s) | 2018-09-17 | PDF 121.9 KB |
| label letter | Cover Letter(s) | 2018-09-17 | PDF 237.5 KB |
| SAR exemption | RF Exposure Info | 2018-09-17 | PDF 45.1 KB |
| internal photos Metadata only | Internal Photos | PDF 2 MB | |
| block diagram Metadata only | Block Diagram | PDF 50.6 KB | |
| schematics Metadata only | Schematics | PDF 289.9 KB | |
| operational description Metadata only | Operational Description | PDF 39.3 KB | |
| parts list Metadata only | Parts List/Tune Up Info | PDF 126.2 KB |
Application Information
| Application ID | 6Oi0TTdgU/P4ueBNnHw5XQ== |
|---|---|
| Final Action Date | 2018-09-17 |
| Application Purpose | Original Equipment |
| Applicant FRN | 0027398882 |
| Model | RSL10SIP |
| Frequency Range | 2402-2480 MHz |
| Equipment Class | DTS - Digital Transmission System |
| Device Description | Bluetooth 5 System-in-Package Module |
| Responsible Party | David Banbury, Design Engineer, david.banbury@onsemi.com , 5198849696 |
| Test Firm | Charles Neal, Nemko Canada Inc. (Ottawa), charles.neal@nemko.com  , 613-737-9680 |
| TCB Email | stuart.beck@nemko.com |
| TCB Scope | A4: UNII devices & low power transmitters using spread spectrum techniques |
| Short-Term Confidentiality | Yes |
| Short-Term Confidentiality Date | 03/16/2019 |
| Long-Term Confidentiality | Yes |
| Grant Deferral | No |
| Modular Equipment | Single Modular Approval |
| Composite Device | No |
| Composite Part | No |
| Cognitive Radio | No |
| Authorization Waiver | No |
| Authorization Waiver Approved | No |
| Section 5301 Certification | Yes |
| Related OET Knowledge DataBase Inquiry | No |
| Grant Comments | Power listed is conducted. The separation distance between this device and the user must be greater than or equal to 5 mm. |
Applications
| Application ID | Date | Purpose |
|---|---|---|
| 6Oi0TTdgU/P4ueBNnHw5XQ== | 2018-09-17 | Original Equipment |
Equipment Authorization
| Frequency | Output | Rules |
|---|---|---|
| 2402-2480 MHz | 0.0034800 | 15C |
Grants
TCB Grant - Application 6Oi0TTdgU/P4ueBNnHw5XQ==
| TCB | GRANT OF EQUIPMENT AUTHORIZATION |
TCB |
| Certification | ||
| Issued Under the Authority of the | ||
| Federal Communications Commission | ||
| By: |
|
Nemko North America, INC. 303 River Road Ottawa, Ontario, K1V 1H2 Canada |
Date of Grant: 09/17/2018 Application Dated: 09/15/2018 |
| ON Semiconductor |
| 611 Kumpf Dr. Unit 200 |
| P.O. Box N2V 1K8, |
| Waterloo, N2V 1K8 Canada |
| Attention: David Banbury , Design Engineer |
| NOT TRANSFERABLE |
| EQUIPMENT AUTHORIZATION is hereby issued to the named GRANTEE, and is VALID ONLY for the equipment identified hereon for use under the Commission's Rules and Regulations listed below. |
| FCC IDENTIFIER: | 2APD9-RSL10SIP |
| Name of Grantee: | ON Semiconductor |
| Equipment Class: | Digital Transmission System |
| Notes: | Bluetooth 5 System-in-Package Module |
| Modular Type: | Single Modular |
| Grant Notes | FCC Rule Parts | Frequency Range (MHZ) | Output Watts | Frequency Tolerance | Emission Designator |
| 15C | 2402.0 - 2480.0 | 0.00348 |
| Power listed is conducted. The separation distance between this device and the user must be greater than or equal to 5 mm. |
EAS Grant - Application 6Oi0TTdgU/P4ueBNnHw5XQ==
| COPY |
FEDERAL COMMUNICATIONS COMMISSION WASHINGTON, D.C. 20554 GRANT OF EQUIPMENT AUTHORIZATION |
COPY |
| Certification |
|
ON Semiconductor 611 Kumpf Dr. Unit 200 P.O. Box N2V 1K8, Waterloo, N2V 1K8 Canada |
Date of Grant: 09/17/2018 Application Dated: 09/15/2018 |
| Attention: David Banbury , Design Engineer |
| NOT TRANSFERABLE |
| EQUIPMENT AUTHORIZATION is hereby issued to the named GRANTEE, and is VALID ONLY for the equipment identified hereon for use under the Commission's Rules and Regulations listed below. |
| FCC IDENTIFIER: | 2APD9-RSL10SIP |
| Name of Grantee: | ON Semiconductor |
| Equipment Class: | Digital Transmission System |
| Notes: | Bluetooth 5 System-in-Package Module |
| Modular Type: | Single Modular |
| Grant Notes | FCC Rule Parts | Frequency Range (MHZ) | Output Watts | Frequency Tolerance | Emission Designator |
| 15C | 2402.0 - 2480.0 | 0.00348 |
| Power listed is conducted. The separation distance between this device and the user must be greater than or equal to 5 mm. |
| Mail To: |