3RD5896 Microwave Oven Teardown Internal Photos - FCC ID A3L3RD5896
FCC ID A3L3RD5896
pcb solder side
Microwave Oven
Document Details
| FCC ID | A3L3RD5896 |
|---|---|
| Document ID | 8711 |
| Document Type | Internal Photos |
| Description | pcb solder side |
| Applicant | Samsung Electronics Co Ltd |
| Equipment Class | Microwave Oven |
| Product Code | 3RD5896 |
| Application ID | ZvpjPOaWVOmVGAlTlUc8Pw== |
| Application Purpose | Original Equipment |
| Application Date | 1998-11-23 |
| Frequency Range | 2450 MHz |
| FRN | 0005810205 |
| Test Firm | Underwriters Laboratories Inc. |
| Certified By | Ben Kim Engineering Manager |
| Short-Term Confidentiality | No |
| Long-Term Confidentiality | No |
| Grant Deferral | No |
| Modular Equipment | Does not apply |
| Composite Device | No |
| Composite Part | No |
| Submitted | 1998-10-01 |
| Available | 1998-11-23 |
| Pages | 0 |
| File Type | JPEG Image |
| File Size | 181358 |
| File SHA-256 | 41358222bcaa6ca560faf3a9276dff2658752e73d06b236216b354462cc8e025 |
| FCC.gov Sources | FCC.gov 8711 |
Related FCC Exhibits
| Document | Type | Available | File |
|---|---|---|---|
| manual | Users Manual | 1998-11-23 | PDF 67.2 KB |
| cover open | Internal Photos | 1998-11-23 | PDF 183.1 KB |
| door open | Internal Photos | 1998-11-23 | PDF 146.6 KB |
| pcb component side | Internal Photos | 1998-11-23 | PDF 192.4 KB |
| pcb solder side | Internal Photos | 1998-11-23 | PDF 177.1 KB |
| front | External Photos | 1998-11-23 | PDF 151.8 KB |
| rear | External Photos | 1998-11-23 | PDF 162.9 KB |
| ID label | ID Label/Location Info | 1998-11-23 | PDF 5.3 KB |
| location | ID Label/Location Info | 1998-11-23 | PDF 162.9 KB |
| block diagram | Block Diagram | 1998-11-23 | PDF 205.8 KB |
| report | Test Report | 1998-11-23 | PDF 2.3 MB |
| cover letter including agency letter | Cover Letter(s) | 1998-11-23 | PDF 7.7 KB |