3RD7593 Microwave Oven Teardown Internal Photos - FCC ID A3L3RD7593
FCC ID A3L3RD7593
PCB SOLDER SIDE
Microwave Oven
Document Details
| FCC ID | A3L3RD7593 |
|---|---|
| Document ID | 13310 |
| Document Type | Internal Photos |
| Description | PCB SOLDER SIDE |
| Applicant | Samsung Electronics Co Ltd |
| Equipment Class | Microwave Oven |
| Product Code | 3RD7593 |
| Application ID | B7UktAzOgdibX1Ja+sMsxA== |
| Application Purpose | Original Equipment |
| Application Date | 1999-01-19 |
| Frequency Range | 2450 MHz |
| FRN | 0005810205 |
| Test Firm | Underwriters Laboratories Inc. |
| Certified By | Ben Kim Engineering Manager |
| Short-Term Confidentiality | No |
| Long-Term Confidentiality | No |
| Grant Deferral | No |
| Modular Equipment | Does not apply |
| Composite Device | No |
| Composite Part | No |
| Submitted | 1998-11-18 |
| Available | 1999-01-19 |
| Pages | 0 |
| File Type | JPEG Image |
| File Size | 21518 |
| File SHA-256 | ae66b9e72a0a5e2885de6850dc0338bbdbb625d4d67e261f0c437517c3671922 |
| FCC.gov Sources | FCC.gov 13310 |
Related FCC Exhibits
| Document | Type | Available | File |
|---|---|---|---|
| MANUAL | Users Manual | 1999-01-19 | PDF 62.9 KB |
| COVER OPEN | Internal Photos | 1999-01-19 | PDF 39.4 KB |
| PCB COMPONENT SIDE | Internal Photos | 1999-01-19 | PDF 24.6 KB |
| PCB SOLDER SIDE | Internal Photos | 1999-01-19 | PDF 21 KB |
| FRONT | External Photos | 1999-01-19 | PDF 17.1 KB |
| FRONT DOOR OPEN | External Photos | 1999-01-19 | PDF 21 KB |
| REAR | External Photos | 1999-01-19 | PDF 22.1 KB |
| LABEL | ID Label/Location Info | 1999-01-19 | PDF 70.1 KB |
| SCHEMATIC | Schematics | 1999-01-19 | PDF 1.2 MB |
| REPORT | Test Report | 1999-01-19 | PDF 2.6 MB |
| COVER LETTER | Cover Letter(s) | 1999-01-19 | PDF 5.6 KB |