BM23SPKXYC2A Bluetooth Modulel Cover... - FCC ID A8TBM23SPKXYC2A
FCC ID A8TBM23SPKXYC2A
Modular Req. Letter
Bluetooth Modulel
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Document Details
| FCC ID | A8TBM23SPKXYC2A |
|---|---|
| Document ID | 2430974 |
| Document Type | Cover Letter(s) |
| Description | Modular Req. Letter |
| Applicant | Microchip Technology Inc. |
| Equipment Class | Bluetooth Modulel |
| Product Code | BM23SPKXYC2A |
| Application ID | hgoXm0TE6bjG8y+be8eAtQ== |
| Application Purpose | Original Equipment |
| Application Date | 2014-11-02 |
| Frequency Range | 2402-2480 MHz |
| FRN | 0001596279 |
| Test Firm | TUV Rheinland Taiwan Ltd. |
| Certified By | Anthony Yen FAE Deputy Manager |
| Short-Term Confidentiality | No |
| Long-Term Confidentiality | No |
| Grant Deferral | No |
| Modular Equipment | Single Modular Approval |
| Composite Device | No |
| Composite Part | No |
| Submitted | 2014-10-29 |
| Available | 2014-11-02 |
| Created | 2014-10-23 |
| Modified | 2014-10-23 |
| Pages | 2 |
| File Type | Adobe Acrobat PDF |
| File Size | 655460 |
| File SHA-256 | 7e048e4b8685295e4fe1e93ed828be7dd953bbc11a5becd452d901a73a0ec262 |
| FCC.gov Sources | FCC.gov 2430974 |
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