FCC ID DC211050
Plasma Etcher
by SPI Supplies
Grantee Code: DC2 Product Code: 11050
Latest application date: 2009-05-27
FCC ID Device Details
Operating Frequencies
| Frequency Range | Application Purpose | Final Action Date |
|---|---|---|
| 13.56 MHz | Original Equipment | 2009-05-27 |
| 13.56 MHz | Original Equipment | 2009-02-25 |
Exhibits
| Document | Type | Available | File |
|---|---|---|---|
| Plasma Prep III Operation Manual | Users Manual | 2009-05-27 | PDF 1.2 MB |
| Plasma Prep III Internal Bottom | Internal Photos | 2009-05-27 | PDF 239.1 KB |
| Plasma Prep III Internal Top | Internal Photos | 2009-05-27 | PDF 123.2 KB |
| Plasma Prep III Internal left | Internal Photos | 2009-05-27 | PDF 131.1 KB |
| Plasma Prep III Right Internal | Internal Photos | 2009-05-27 | PDF 193.6 KB |
| Plasma Prep III External Front | External Photos | 2009-05-27 | PDF 149.5 KB |
| Plasma Prep III External Rear | External Photos | 2009-05-27 | PDF 169.9 KB |
| PPIII Label | ID Label/Location Info | 2009-05-27 | PDF 14.3 KB |
| PPIII Label Location | ID Label/Location Info | 2009-05-27 | PDF 16.1 KB |
| Plasma Prep III Label Location | ID Label/Location Info | 2009-05-27 | PDF 175 KB |
| Plasma Prep III Labels | ID Label/Location Info | 2009-05-27 | PDF 8.8 KB |
| Plasma Prep III Curcuit Diagrams | Schematics | 2009-05-27 | PDF 110.1 KB |
| Plasma Prep III Test Set up Images | Test Setup Photos | 2009-05-27 | PDF 188.5 KB |
| Plasma Prep III Test Report | Test Report | 2009-05-27 | PDF 575.1 KB |
Application Information
| Application ID | kdhMeM9jtZR+nESJXnbF3Q== |
|---|---|
| Final Action Date | 2009-05-27 |
| Application Purpose | Original Equipment |
| Applicant FRN | 0018499509 |
| Model | 11050 |
| Frequency Range | 13.56 MHz |
| Equipment Class | 8CC - Part 18 Consumer Device |
| Device Description | Plasma Etcher |
| Responsible Party | Eugene E Rodek, Vice President, erodek@2spi.com |
| Test Firm | Albert Fanella, BEC Incorporated, afanella@bec-ccl.com |
| Short-Term Confidentiality | No |
| Long-Term Confidentiality | No |
| Grant Deferral | No |
| Modular Equipment | Does not apply |
| Composite Device | No |
| Composite Part | No |
| Cognitive Radio | No |
| Authorization Waiver | No |
| Authorization Waiver Approved | No |
| Section 5301 Certification | Yes |
| Related OET Knowledge DataBase Inquiry | No |
Applications
| Application ID | Date | Purpose |
|---|---|---|
| kdhMeM9jtZR+nESJXnbF3Q== | 2009-05-27 | Original Equipment |
| 0/z9OVy+9aNYMcmNtnWziw== | 2009-02-25 | Original Equipment |
Equipment Authorization
| Frequency | Rules |
|---|---|
| 13.56 MHz | 18 |
Grants
TCB Grant - Application kdhMeM9jtZR+nESJXnbF3Q==
This application does not exist.
EAS Grant - Application kdhMeM9jtZR+nESJXnbF3Q==
| COPY |
FEDERAL COMMUNICATIONS COMMISSION WASHINGTON, D.C. 20554 GRANT OF EQUIPMENT AUTHORIZATION |
COPY |
| Certification |
|
SPI Supplies Division of Structure Probe Inc 569 E. Gay StreetP.O. Box 656, West Chester, PA 19380 United States |
Date of Grant: 05/27/2009 Application Dated: 04/02/2009 |
| Attention: Eugene Rodek , Vice President |
| NOT TRANSFERABLE |
| EQUIPMENT AUTHORIZATION is hereby issued to the named GRANTEE, and is VALID ONLY for the equipment identified hereon for use under the Commission's Rules and Regulations listed below. |
| FCC IDENTIFIER: | DC211050 |
| Name of Grantee: | SPI Supplies |
| Equipment Class: | Part 18 Consumer Device |
| Notes: | Plasma Etcher |
| Modular Type: | Does not apply |
| Grant Notes | FCC Rule Parts | Frequency Range (MHZ) | Output Watts | Frequency Tolerance | Emission Designator |
| 18 | 13.56 - 13.56 |
| Mail To: |