TLSR8298DK56D TLSR8298 Development... - FCC ID OEOTLSR8298DK56D

FCC ID OEOTLSR8298DK56D

Modular declaration

TLSR8298 Development Board

by Telink Semiconductor (Shanghai) Co., Ltd.

Document preview loads when visible.

Document Details

FCC IDOEOTLSR8298DK56D
Document ID6043855
Document TypeCover Letter(s)
DescriptionModular declaration
Document TitleFCC?Cover?letter?limit?modular?approval?1x
ApplicantTelink Semiconductor (Shanghai) Co., Ltd.
Equipment ClassTLSR8298 Development Board
Product CodeTLSR8298DK56D
Application IDSkOhzkomoTTaJhOEMBrRaw==
Application PurposeOriginal Equipment
Application Date2022-08-08
Frequency Range2402-2480 MHz
FRN0021911706
Test FirmBlueAsia of Technical Services (Shenzhen)
Certified ByXiang Li
Short-Term ConfidentialityNo
Long-Term ConfidentialityNo
Grant DeferralNo
Modular EquipmentLimited Single Modular Approval
Composite DeviceNo
Composite PartNo
Submitted2022-08-08
Available2022-08-08
Created2022-08-08
Modified0002-01-01
Pages2
File TypeAdobe Acrobat PDF
File Size38061
File SHA-2568c75e1d4ca9b7cc39679b0db8498355c32cd6ccd26d5ac04c27677a892b442b5
PDF Metadata AuthorASUS
PDF Metadata ProducerAcrobat Distiller 15.0 (Windows) ASUS
FCC.gov SourcesFCC.gov 6043855, FCC.gov 6043900, FCC.gov 6043856

Related FCC Exhibits

DocumentTypeAvailableFile
user manualUsers Manual2022-08-08PDF 1.3 MB
INTERNAL PHOTOInternal Photos2022-08-08PDF 703.8 KB
EXTERNAL PHOTOExternal Photos2022-08-08PDF 703.8 KB
labelID Label/Location Info2022-08-08PDF 412.2 KB
SETUP PHOTOTest Setup Photos2022-08-08PDF 303.7 KB
Test ReportTest Report2022-08-08PDF 4.7 MB
Compliance list statement-996369 D03-LMACover Letter(s)2022-08-08PDF 211.4 KB
FCC AUTHORIZATION LETTERCover Letter(s)2022-08-08PDF 336.3 KB
FCC CONFIDENCE LETTERCover Letter(s)2022-08-08PDF 205.8 KB
Modular declarationCover Letter(s)2022-08-08PDF 37.2 KB
RF EXPOSURE LETTERRF Exposure Info2022-08-08PDF 342.1 KB
block diagram Metadata onlyBlock DiagramPDF 84.2 KB
schematics Metadata onlySchematicsPDF 155.5 KB
operation description Metadata onlyOperational DescriptionPDF 199.9 KB