700 444-2225 Cover Letter(s) - FCC ID UA9700
FCC ID UA9700
Cover letter
444-2225
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Document Details
| FCC ID | UA9700 |
|---|---|
| Document ID | 3006424 |
| Document Type | Cover Letter(s) |
| Description | Cover letter |
| Document Title | cover_letters_for_fcc_application.(3)x |
| Applicant | Summit Semiconductor LLC |
| Equipment Class | 444-2225 |
| Product Code | 700 |
| Application ID | aV5+XYKtFyf4L9LqYTQJlQ== |
| Application Purpose | Class II Permissive Change |
| Application Date | 2016-05-26 |
| Frequency Range | 5180-5240 MHz |
| FRN | 0023775380 |
| Test Firm | Element Materials Technology |
| Certified By | Ken Boehlke Principal Engineer |
| Short-Term Confidentiality | No |
| Long-Term Confidentiality | No |
| Grant Deferral | No |
| Modular Equipment | Single Modular Approval |
| Composite Device | Yes |
| Composite Part | No |
| Submitted | 2016-05-26 |
| Available | 2016-05-26 |
| Created | 2016-05-26 |
| Modified | 2016-05-26 |
| Pages | 2 |
| File Type | Adobe Acrobat PDF |
| File Size | 109047 |
| File SHA-256 | 425c99fcf27d03c7c291dbc98de39df06be7bc5165a263e19416a4504190dc13 |
| PDF Metadata Author | valbertson |
| PDF Metadata Producer | Acrobat Distiller 10.1.16 (Windows) valbertson |
| FCC.gov Sources | FCC.gov 3006424 |
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