MDG875V6PIN WI-FI AP MODULE Cover Letter(s) - FCC ID V4VMDG875V6PIN

FCC ID V4VMDG875V6PIN

Modual Approval Letter

WI-FI AP MODULE

by Shenzhen Gongjin Electronics Co., Ltd

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Document Details

FCC IDV4VMDG875V6PIN
Document ID1154523
Document TypeCover Letter(s)
DescriptionModual Approval Letter
Document TitleModular Approval Letter
ApplicantShenzhen Gongjin Electronics Co., Ltd
Equipment ClassWI-FI AP MODULE
Product CodeMDG875V6PIN
Application IDmM/B9zLxKleyGaq/s8lJ/Q==
Application PurposeOriginal Equipment
Application Date2009-08-18
Frequency Range2412-2462 MHz
FRN0017516113
Test FirmSinTek Laboratory Co., Ltd.
Certified ByZheyu Li Manager
Short-Term ConfidentialityNo
Long-Term ConfidentialityNo
Grant DeferralNo
Modular EquipmentSingle Modular Approval
Composite DeviceNo
Composite PartNo
Submitted2009-08-17
Available2009-08-18
Created2009-07-29
Modified2009-08-18
Pages1
File TypeAdobe Acrobat PDF
File Size43820
File SHA-2565e3394dad7d4fcdec90423e9dea7aa07cddd63329deba74ddead3f954e5f4e6c
PDF Metadata AuthorOwner
PDF Metadata CreatorpdfFactory Pro www.pdffactory.com
PDF Metadata ProducerpdfFactory Pro 2.26 (Windows XP Home Chinese)
FCC.gov SourcesFCC.gov 1154523

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