0003 RF MCU Evaluation Kit Cover Letter(s) - FCC ID XBU0003
FCC ID XBU0003
POA
RF MCU Evaluation Kit
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Document Details
| FCC ID | XBU0003 |
|---|---|
| Document ID | 5396991 |
| Document Type | Cover Letter(s) |
| Description | POA |
| Applicant | Musical Industries Limited |
| Equipment Class | RF MCU Evaluation Kit |
| Product Code | 0003 |
| Application ID | 7DFv3LwYXc6s2DEEu3Z5MQ== |
| Application Purpose | Original Equipment |
| Application Date | 2021-08-18 |
| FRN | 0019632041 |
| Test Firm | SGS Japan Inc. Yokohama Lab |
| Certified By | Masaaki Suzuki Manager |
| Short-Term Confidentiality | No |
| Long-Term Confidentiality | No |
| Short-Term Confidentiality Date | 11/16/2021 |
| Grant Deferral | No |
| Modular Equipment | Does not apply |
| Composite Device | Yes |
| Composite Part | No |
| Submitted | 2021-08-18 |
| Available | 2021-08-18 |
| Pages | 1 |
| File Type | Adobe Acrobat PDF |
| File Size | 269154 |
| File SHA-256 | 837b0ceb7f191e1efc5340bdb96fb2090df91eed986530e2b3d9194d61df9ced |
| FCC.gov Sources | FCC.gov 5396991 |
Related FCC Exhibits
| Document | Type | Available | File |
|---|---|---|---|
| manual | Users Manual | 2021-11-16 | PDF 4.7 MB |
| Internal Photos | Internal Photos | 2021-11-16 | PDF 346.8 KB |
| External Photos | External Photos | 2021-11-16 | PDF 346.8 KB |
| Label | ID Label/Location Info | 2021-08-18 | PDF 441.3 KB |
| Test setup photo | Test Setup Photos | 2021-11-16 | PDF 1.6 MB |
| Test Report | Test Report | 2021-08-18 | PDF 2.9 MB |
| Applicant cover letter | Cover Letter(s) | 2021-08-18 | PDF 373.2 KB |
| Confidentiality Letter | Cover Letter(s) | 2021-08-18 | PDF 268 KB |
| POA | Cover Letter(s) | 2021-08-18 | PDF 262.8 KB |
| Block Diagram Metadata only | Block Diagram | PDF 59.4 KB | |
| Schematics Metadata only | Schematics | PDF 359.2 KB | |
| operation description Metadata only | Operational Description | PDF 128.6 KB |