GS2011MIES Low Power Wi-Fi Modules Cover Letter Modular Approval Letter Gainspan
Gainspan Low Power Wi-Fi Modules
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File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.5 Linearized : Yes Author : HDong Create Date : 2014:08:21 14:01:23-07:00 Modify Date : 2014:08:21 14:01:23-07:00 XMP Toolkit : Adobe XMP Core 4.2.1-c041 52.342996, 2008/05/07-20:48:00 Format : application/pdf Title : Microsoft Word - SCS-F26 Modular approval letter (Ver 7.0) Creator : HDong Creator Tool : PScript5.dll Version 5.2.2 Producer : Acrobat Distiller 9.0.0 (Windows) Document ID : uuid:8555d8d5-fd4c-46d5-89bb-8a76bbebe8e6 Instance ID : uuid:e7da2043-f289-4d9a-bd56-5ead79f16911 Page Count : 3