MU733W HSPA+ Module Cover Letter(s) - FCC ID A3LMU733-W
FCC ID A3LMU733-W
Authorization letter (William)
HSPA+ Module
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Document Details
| FCC ID | A3LMU733-W |
|---|---|
| Document ID | 1856496 |
| Document Type | Cover Letter(s) |
| Description | Authorization letter (William) |
| Document Title | Your company letter head |
| Applicant | Samsung Electronics Co Ltd |
| Equipment Class | HSPA+ Module |
| Product Code | MU733W |
| Application ID | DDuGPQJ1vZ7fypP+LeBn1w== |
| Application Purpose | Change in Identification |
| Application Date | 2012-12-11 |
| Frequency Range | 1712.4-1752.6 MHz |
| FRN | 0005810205 |
| Test Firm | SGS Korea Co., Ltd. |
| Certified By | Sang Kyung (Peter) Ra |
| Short-Term Confidentiality | No |
| Long-Term Confidentiality | No |
| Short-Term Confidentiality Date | 06/09/2013 |
| Grant Deferral | No |
| Modular Equipment | Limited Single Modular Approval |
| Composite Device | No |
| Composite Part | No |
| Submitted | 2012-12-11 |
| Available | 2012-12-11 |
| Created | 2012-12-04 |
| Modified | 2012-12-04 |
| Pages | 1 |
| File Type | Adobe Acrobat PDF |
| File Size | 70343 |
| File SHA-256 | 606ba38eb7b6d8604df33a779511dc26ec8674b7c22204d634575d1927356a13 |
| PDF Metadata Author | WMEG |
| PDF Metadata Creator | Microsoft Office Word 2007 |
| PDF Metadata Producer | Microsoft Office Word 2007 |
| FCC.gov Sources | FCC.gov 1856496 |
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