Korean Source KCC-RMI-FNM-BOND
Bond Cellular Bonding Solution
Applicant: (주) 펀노마드 Model: BOND Date: 2012-12-03
| Record Type | Radio conformity assessment |
|---|---|
| Authorization / Certificate Number | KCC-RMI-FNM-BOND |
| Applicant / Company | (주) 펀노마드 |
| Device / Product Name | Bond Cellular Bonding Solution |
| Model | BOND |
| Manufacturer | Teradek LLC |
| Country | 미국 |
| Date | 2012-12-03 |
About Korean KC / RRA IDs
Korean equipment approvals can appear under KCC, MSIP, RRA, NRRA, or KC identifiers depending on the rule set and approval year. Radio and EMC products are commonly published by the Radio Research Agency, while electrical and electronics safety certifications are commonly published through Safety Korea and KATS systems.
FCCID.io lists English fields first when available, keeps the Korean source text as the authoritative alternate, and uses legacy FCCID.io RRA data only as supplemental fallback.