AIOS4-0F HEOS 4.X Platform Module Cover Letter Modular Approval Letter Arcadyan Technology
Arcadyan Technology HEOS 4.X Platform Module
Related Documents
User Manual | Users Manual | |
OEM Manual | Users Manual | |
Label & Label Location | ID Label/Location Info | |
Internal Photos | Internal Photos | |
External Photos | External Photos |
Source Exif Data [exif.tools]:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : Yes Encryption : Standard V4.4 (128-bit) User Access : Print, Extract, Print high-res Author : ChristyFan Create Date : 2015:10:06 16:15:56+08:00 Modify Date : 2015:10:06 16:38:14+08:00 XMP Toolkit : Adobe XMP Core 4.2.1-c043 52.372728, 2009/01/18-15:08:04 Creator Tool : PScript5.dll Version 5.2.2 Metadata Date : 2015:10:06 16:38:14+08:00 Producer : Acrobat Distiller 9.0.0 (Windows) Format : application/pdf Title : Microsoft Word - FCC and IC Applicant form_拆開_2015.8.25_FCC.doc Creator : ChristyFan Document ID : uuid:87c640a9-4a87-43be-abc7-694027670790 Instance ID : uuid:b25f0c5d-58a6-4eed-9edb-2548cd893f1e Page Count : 1