1. FCC ID
  2. ZQ6
  3. ZQ6-WSDT752BSC
  4. Modular Appr Letter

WSDT752BSC BLE SiP Cover Letter(s) - FCC ID ZQ6-WSDT752BSC

FCC ID ZQ6-WSDT752BSC

Modular Appr Letter

BLE SiP

by AMPAK Technology Inc.

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Document Details

FCC IDZQ6-WSDT752BSC
Document ID3949467
Document TypeCover Letter(s)
DescriptionModular Appr Letter
ApplicantAMPAK Technology Inc.
Equipment ClassBLE SiP
Product CodeWSDT752BSC
Application IDb7FsiE1ZjKmFsRA8AcQ+cg==
Application PurposeOriginal Equipment
Application Date2018-08-05
Frequency Range2402-2480 MHz
FRN0021013693
Test FirmTUV Rheinland Taiwan Ltd.
Certified ByChangYi Tsai Manager
Short-Term ConfidentialityNo
Long-Term ConfidentialityNo
Grant DeferralNo
Modular EquipmentSingle Modular Approval
Composite DeviceNo
Composite PartNo
Submitted2018-08-03
Available2018-08-05
Created2018-07-17
Modified2018-07-17
Pages2
File TypeAdobe Acrobat PDF
File Size70533
File SHA-256117e1f0f1460a8ed22470c1a60e2d52a0d53e7fbdfd26706aa9c97c9b5dbdcf1
PDF Metadata ProducerApeosPort-III C4400 ApeosPort-III C4400
FCC.gov SourcesFCC.gov 3949467

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