All original source fields
{
"attachmentFileCntForCd1": "",
"attachmentFileCntForCd2": "",
"attachmentFileKey": "",
"attachmentFileName": "",
"bodySar": "―",
"date": "2013-02-22",
"elecWave": "D1A, D1B, D1C, D1D, D1F, D1X, D7W, G1A, G1B, G1C, G1D,\\nG1F, G1X, G7W\\n(5M00) 1927.2-1977.5MHz (100kHz separation, 504ch)\\n(10M0) 1934.7-1975.0MHz (100kHz separation, 404ch)\\n(15M0) 1942.2-1972.5MHz (100kHz separation, 304ch)\\n(20M0) 1949.7-1970.0MHz (100kHz separation, 204ch)\\n(5M00) 1450.4-1460.4MHz (100kHz separation, 101ch)\\n(10M0) 1452.9-1457.9MHz (100kHz separation, 51ch)\\n(15M0) 1455.4MHz\\n(5M00) 832.5-842.5MHz (100kHz separation, 101ch)\\n(10M0) 835.0-840.0MHz (100kHz separation, 51ch)\\n(15M0) 837.5MHz (1ch)\\n23 dBm or less",
"fqMaintainFunc": "無",
"name": "HUAWEI Technologies Japan K.K.",
"note": "",
"number": "206-000285",
"organName": "EMCCert Dr. Rasek GmbH",
"radioEquipmentCode": "第2条第11号の19に規定する特定無線設備",
"spuriousRules": "新スプリアス規定",
"techCode": "相互承認(MRA)による工事設計認証",
"typeName": "Smartphone, Model HW-03E"
}